Hosted by Gerry Partida (CTO, Summit Interconnect), this webinar will cover the following topics:

• Delamination with HDI Designs
• Increasing Moisture Entrapment by use of Copper Foil
• Examples of Delamination in both Stack-Up Diagram and Edge of PCBs
• Edge Plating
• Threshold of Concern and How to Apply
• And much more!